# IEEE Transactions on Device and Materials Reliability

**Type:** Journals  
**Canonical URL:** https://scholariq.org/journals/ieee-transactions-on-device-and-materials-reliability/

## Facts

| Field | Value |
| --- | --- |
| Open Access | false |
| ISSN-L | 1530-4388 |
| ISSNs | 1530-4388,1558-2574 |
| OpenAlex ID | https://openalex.org/S128536549 |
| Publisher | Institute of Electrical and Electronics Engineers |

## Journal papers

- [A Highly Reliable Memory Cell Design Combined With Layout-Level Approach to Tolerant Single-Event Upsets](https://scholariq.org/papers/a-highly-reliable-memory-cell-design-combined-with-layout-level-approach-to/)
- [An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue](https://scholariq.org/papers/an-improved-thermal-network-model-of-the-igbt-module-for-wind-power-converters/)

---
Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.