# Accelerator-free through silicon vias electroplating based on novel polysuccinimide derivatives suppressors

**Type:** Papers  
**Canonical URL:** https://scholariq.org/papers/accelerator-free-through-silicon-vias-electroplating-based-on-novel/

## Facts

| Field | Value |
| --- | --- |
| Author Names | Guanbin Lu,Yang Chao,Yuting Feng,Chi Zhang,Wen‐Bin Cai,Yuanrong Cheng |
| Citations | 0 |
| DOI | 10.1016/j.electacta.2025.148097 |
| Fields | Engineering,Materials Science |
| Open Access | false |
| OA Status | closed |
| OpenAlex ID | https://openalex.org/W7117558018 |
| Type | article |
| Year | 2025 |

## Paper authors

- [Yuanrong Cheng](https://scholariq.org/researchers/yuanrong-cheng/)

## Paper primary topic

- [Electrodeposition and Electroless Coatings](https://scholariq.org/topics/electrodeposition-and-electroless-coatings/)

## Paper topics

- [Electrodeposition and Electroless Coatings](https://scholariq.org/topics/electrodeposition-and-electroless-coatings/)
- [Supercapacitor Materials and Fabrication](https://scholariq.org/topics/supercapacitor-materials-and-fabrication/)

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Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.