# Ascorbic Acid-Assisted Self-Assembly of 4-Aminothiophenol to Enhance Interfacial Adhesion between Copper and Ajinomoto Build-up Film

**Type:** Papers  
**Canonical URL:** https://scholariq.org/papers/ascorbic-acid-assisted-self-assembly-of-4-aminothiophenol-to-enhance-interfacial/

## Facts

| Field | Value |
| --- | --- |
| Author Names | Xindi Xu,Chi Zhang,Wei-Yi Zhang,Yang Chao,MA Xian-yin,Yuanrong Cheng,Tianwen Jiang,Wen-Bin Cai |
| Citations | 0 |
| DOI | 10.1021/acs.langmuir.5c05774 |
| Fields | Engineering,Materials Science |
| Open Access | false |
| OA Status | closed |
| OpenAlex ID | https://openalex.org/W7127914726 |
| PMID | 41640248 |
| Type | article |
| Year | 2026 |

## Paper authors

- [Yuanrong Cheng](https://scholariq.org/researchers/yuanrong-cheng/)

## Paper primary topic

- [Copper Interconnects and Reliability](https://scholariq.org/topics/copper-interconnects-and-reliability/)

## Paper topics

- [Copper Interconnects and Reliability](https://scholariq.org/topics/copper-interconnects-and-reliability/)
- [Electronic Packaging and Soldering Technologies](https://scholariq.org/topics/electronic-packaging-and-soldering-technologies/)

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Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.