# Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds

**Type:** Papers  
**Canonical URL:** https://scholariq.org/papers/behavior-of-aluminum-oxide-intermetallics-and-voids-in-cu-al-wire-bonds/

## Facts

| Field | Value |
| --- | --- |
| Author Names | Huining Xu,C. Liu,Vadim V. Silberschmidt,Stevin S. Pramana,Timothy J. White,Zhong Chen,Viola L. Acoff |
| Citations | 247 |
| DOI | 10.1016/j.actamat.2011.05.041 |
| Fields | Engineering,Materials Science |
| Open Access | false |
| OA Status | closed |
| OpenAlex ID | https://openalex.org/W2000637463 |
| Type | article |
| Year | 2011 |

## Paper authors

- [Vadim V. Silberschmidt](https://scholariq.org/researchers/vadim-v-silberschmidt/)

## Paper primary topic

- [Copper Interconnects and Reliability](https://scholariq.org/topics/copper-interconnects-and-reliability/)

## Paper topics

- [Electronic Packaging and Soldering Technologies](https://scholariq.org/topics/electronic-packaging-and-soldering-technologies/)
- [Copper Interconnects and Reliability](https://scholariq.org/topics/copper-interconnects-and-reliability/)
- [Aluminum Alloys Composites Properties](https://scholariq.org/topics/aluminum-alloys-composites-properties/)

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Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.