# Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder

**Type:** Papers  
**Canonical URL:** https://scholariq.org/papers/effects-of-tio2-nanoparticles-addition-on-microstructure-microhardness-and/

## Facts

| Field | Value |
| --- | --- |
| Author Names | Yu Tang,G.Y. Li,Y.C. Pan |
| Citations | 136 |
| DOI | 10.1016/j.matdes.2013.10.033 |
| Fields | Engineering |
| Open Access | false |
| OA Status | closed |
| OpenAlex ID | https://openalex.org/W2007647553 |
| Type | article |
| Year | 2013 |

## Paper authors

- [Yu Tang](https://scholariq.org/researchers/yu-tang/)

## Paper journal

- [Materials & Design (1980-2015)](https://scholariq.org/journals/materials-and-design-1980-2015/)

## Paper primary topic

- [Electronic Packaging and Soldering Technologies](https://scholariq.org/topics/electronic-packaging-and-soldering-technologies/)

## Paper topics

- [Electronic Packaging and Soldering Technologies](https://scholariq.org/topics/electronic-packaging-and-soldering-technologies/)
- [Aluminum Alloys Composites Properties](https://scholariq.org/topics/aluminum-alloys-composites-properties/)
- [Advanced Welding Techniques Analysis](https://scholariq.org/topics/advanced-welding-techniques-analysis/)

---
Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.