# Formation and growth of interfacial intermetallics in Sn-0.3Ag-0.7Cu-xCeO2/Cu solder joints during the reflow process

**Type:** Papers  
**Canonical URL:** https://scholariq.org/papers/formation-and-growth-of-interfacial-intermetallics-in-sn-0-3ag-0-7cu-xceo2-cu/

## Facts

| Field | Value |
| --- | --- |
| Author Names | Yu Tang,Qinhan Guo,Shuqiong Luo,Z.H. Li,G.Y. Li,Chaojun Hou,Zichun Zhong,Jiajun Zhuang |
| Citations | 43 |
| DOI | 10.1016/j.jallcom.2018.11.156 |
| Fields | Engineering,Materials Science |
| Open Access | false |
| OA Status | closed |
| OpenAlex ID | https://openalex.org/W2900779754 |
| Type | article |
| Year | 2018 |

## Paper authors

- [Chaojun Hou](https://scholariq.org/researchers/chaojun-hou/)
- [Jiajun Zhuang](https://scholariq.org/researchers/jiajun-zhuang/)

## Paper primary topic

- [Electronic Packaging and Soldering Technologies](https://scholariq.org/topics/electronic-packaging-and-soldering-technologies/)

## Paper topics

- [Electronic Packaging and Soldering Technologies](https://scholariq.org/topics/electronic-packaging-and-soldering-technologies/)
- [Intermetallics and Advanced Alloy Properties](https://scholariq.org/topics/intermetallics-and-advanced-alloy-properties/)

---
Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.