# High Solid Content Liquid Metal Ink for Flexible Printed Circuits: Formulation, Stability, and Multi‐Layer Integration

**Type:** Papers  
**Canonical URL:** https://scholariq.org/papers/high-solid-content-liquid-metal-ink-for-flexible-printed-circuits-formulation/

## Facts

| Field | Value |
| --- | --- |
| Author Names | Yu‐Chieh Chiu,Fang‐Chen Kuo,Yun‐Hsuan Lin,Ying‐Chih Liao |
| Citations | 5 |
| DOI | 10.1002/admt.202500333 |
| Fields | Engineering,Neuroscience |
| Open Access | false |
| OA Status | closed |
| OpenAlex ID | https://openalex.org/W4412059952 |
| Type | article |
| Year | 2025 |

## Paper authors

- [Yu‐Chieh Chiu](https://scholariq.org/researchers/yu-chieh-chiu/)

## Paper primary topic

- [Advanced Sensor and Energy Harvesting Materials](https://scholariq.org/topics/advanced-sensor-and-energy-harvesting-materials/)

## Paper topics

- [Advanced Sensor and Energy Harvesting Materials](https://scholariq.org/topics/advanced-sensor-and-energy-harvesting-materials/)
- [Nanomaterials and Printing Technologies](https://scholariq.org/topics/nanomaterials-and-printing-technologies/)
- [Tactile and Sensory Interactions](https://scholariq.org/topics/tactile-and-sensory-interactions/)

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Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.