# Hydrophobic copper nanowires for enhancing condensation heat transfer

**Type:** Papers  
**Canonical URL:** https://scholariq.org/papers/hydrophobic-copper-nanowires-for-enhancing-condensation-heat-transfer/

## Facts

| Field | Value |
| --- | --- |
| Author Names | Rongfu Wen,Qian Li,Jiafeng Wu,Gensheng Wu,Wei Wang,Yunfei Chen,Xuehu Ma,Dongliang Zhao,Ronggui Yang |
| Citations | 245 |
| DOI | 10.1016/j.nanoen.2017.01.018 |
| Fields | Engineering,Materials Science |
| Open Access | true |
| OA Status | green |
| OA URL | https://www.osti.gov/biblio/1460873 |
| OpenAlex ID | https://openalex.org/W2571910611 |
| Type | article |
| Year | 2017 |

## Paper authors

- [Yunfei Chen](https://scholariq.org/researchers/yunfei-chen/)

## Paper primary topic

- [Surface Modification and Superhydrophobicity](https://scholariq.org/topics/surface-modification-and-superhydrophobicity/)

## Paper topics

- [Surface Modification and Superhydrophobicity](https://scholariq.org/topics/surface-modification-and-superhydrophobicity/)
- [Nanomaterials and Printing Technologies](https://scholariq.org/topics/nanomaterials-and-printing-technologies/)
- [Fluid Dynamics and Thin Films](https://scholariq.org/topics/fluid-dynamics-and-thin-films/)

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Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.