# Microscratch testing method for systematic evaluation of the adhesion of atomic layer deposited thin films on silicon

**Type:** Papers  
**Canonical URL:** https://scholariq.org/papers/microscratch-testing-method-for-systematic-evaluation-of-the-adhesion-of-atomic/

## Facts

| Field | Value |
| --- | --- |
| Author Names | Lauri Kilpi,Oili Ylivaara,Antti Vaajoki,Jari Malm,Sakari Sintonen,M. Tuominen,Riikka L. Puurunen,Helena Ronkainen |
| Citations | 35 |
| DOI | 10.1116/1.4935959 |
| Fields | Engineering,Materials Science |
| Open Access | true |
| OA Status | bronze |
| OA URL | https://avs.scitation.org/doi/pdf/10.1116/1.4935959 |
| OpenAlex ID | https://openalex.org/W2178245272 |
| Type | article |
| Year | 2015 |

## Paper authors

- [Lauri Kilpi](https://scholariq.org/researchers/lauri-kilpi/)

## Paper primary topic

- [Semiconductor materials and devices](https://scholariq.org/topics/semiconductor-materials-and-devices/)

## Paper topics

- [Semiconductor materials and devices](https://scholariq.org/topics/semiconductor-materials-and-devices/)
- [Metal and Thin Film Mechanics](https://scholariq.org/topics/metal-and-thin-film-mechanics/)
- [Diamond and Carbon-based Materials Research](https://scholariq.org/topics/diamond-and-carbon-based-materials-research/)

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Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.