# Self‐assembly Mechanism and Chiral Transfer in CuO Superstructures

**Type:** Papers  
**Canonical URL:** https://scholariq.org/papers/self-assembly-mechanism-and-chiral-transfer-in-cuo-superstructures/

## Facts

| Field | Value |
| --- | --- |
| Author Names | Jun Zhang,Renaud A. L. Vallée,Zdravko Kochovski,Wei Zhang,Chen Shen,Florian Bertram,Nicola Pinna |
| Citations | 23 |
| DOI | 10.1002/anie.202305353 |
| Fields | Engineering,Materials Science |
| Open Access | true |
| OA Status | bronze |
| OA URL | https://onlinelibrary.wiley.com/doi/pdfdirect/10.1002/anie.202305353 |
| OpenAlex ID | https://openalex.org/W4367059843 |
| PMID | 37186081 |
| Type | article |
| Year | 2023 |

## Paper authors

- [Chen Shen](https://scholariq.org/researchers/chen-shen/)

## Paper primary topic

- [Copper-based nanomaterials and applications](https://scholariq.org/topics/copper-based-nanomaterials-and-applications/)

## Paper topics

- [Copper-based nanomaterials and applications](https://scholariq.org/topics/copper-based-nanomaterials-and-applications/)
- [Supramolecular Self-Assembly in Materials](https://scholariq.org/topics/supramolecular-self-assembly-in-materials/)

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Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.