# Thermal Coupling Analysis in a Multichip Paralleled IGBT Module for a DFIG Wind Turbine Power Converter

**Type:** Papers  
**Canonical URL:** https://scholariq.org/papers/thermal-coupling-analysis-in-a-multichip-paralleled-igbt-module-for-a-dfig-wind/

## Facts

| Field | Value |
| --- | --- |
| Author Names | Hui Li,Xinglin Liao,Zheng Zeng,Yaogang Hu,Yang Li,Shengquan Liu,Li Ran |
| Citations | 64 |
| DOI | 10.1109/tec.2016.2614526 |
| Fields | Engineering |
| Open Access | false |
| OA Status | closed |
| OpenAlex ID | https://openalex.org/W2528388226 |
| Type | article |
| Year | 2016 |

## Paper authors

- [Shengquan Liu](https://scholariq.org/researchers/shengquan-liu/)

## Paper primary topic

- [Silicon Carbide Semiconductor Technologies](https://scholariq.org/topics/silicon-carbide-semiconductor-technologies/)

## Paper topics

- [Silicon Carbide Semiconductor Technologies](https://scholariq.org/topics/silicon-carbide-semiconductor-technologies/)
- [Electromagnetic Compatibility and Noise Suppression](https://scholariq.org/topics/electromagnetic-compatibility-and-noise-suppression/)
- [HVDC Systems and Fault Protection](https://scholariq.org/topics/hvdc-systems-and-fault-protection/)

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Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.