# Thermal curing behavior of phenol formaldehyde resin-impregnated paper evaluated using DSC and dielectric analysis

**Type:** Papers  
**Canonical URL:** https://scholariq.org/papers/thermal-curing-behavior-of-phenol-formaldehyde-resin-impregnated-paper-evaluated/

## Facts

| Field | Value |
| --- | --- |
| Author Names | Nitin Gupta,Arunjunai Raj Mahendran,Stephanie Weiss,Mohammed Khalifa |
| Citations | 15 |
| DOI | 10.1007/s10973-023-12843-5 |
| Fields | Engineering,Materials Science |
| Open Access | false |
| OA Status | closed |
| OpenAlex ID | https://openalex.org/W4391450853 |
| Type | article |
| Year | 2024 |

## Paper authors

- [Nitin Gupta](https://scholariq.org/researchers/nitin-gupta/)

## Paper primary topic

- [Epoxy Resin Curing Processes](https://scholariq.org/topics/epoxy-resin-curing-processes/)

## Paper topics

- [Epoxy Resin Curing Processes](https://scholariq.org/topics/epoxy-resin-curing-processes/)
- [Thermal and Kinetic Analysis](https://scholariq.org/topics/thermal-and-kinetic-analysis/)
- [Injection Molding Process and Properties](https://scholariq.org/topics/injection-molding-process-and-properties/)

---
Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.