# Jun Wei

**Type:** Researchers  
**Canonical URL:** https://scholariq.org/researchers/jun-wei/

## Facts

| Field | Value |
| --- | --- |
| Citations | 21,820 |
| Field | Electronic Packaging and Soldering Technologies |
| h-index | 74 |
| i10-index | 219 |
| Last Known Institution | Guizhou Normal University |
| OpenAlex ID | https://openalex.org/A5101584602 |
| ORCID iD | https://orcid.org/0000-0002-9583-1346 |
| Works | 463 |

## Researcher topics

- [3D IC and TSV technologies](https://scholariq.org/topics/3d-ic-and-tsv-technologies/)
- [Electronic Packaging and Soldering Technologies](https://scholariq.org/topics/electronic-packaging-and-soldering-technologies/)
- [Additive Manufacturing and 3D Printing Technologies](https://scholariq.org/topics/additive-manufacturing-and-3d-printing-technologies/)
- [Aluminum Alloys Composites Properties](https://scholariq.org/topics/aluminum-alloys-composites-properties/)
- [Additive Manufacturing Materials and Processes](https://scholariq.org/topics/additive-manufacturing-materials-and-processes/)

## Researcher university

- [Guizhou Normal University](https://scholariq.org/institutions/guizhou-normal-university/)

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Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.