# K. N. Tu

**Type:** Researchers  
**Canonical URL:** https://scholariq.org/researchers/k-n-tu/

## Facts

| Field | Value |
| --- | --- |
| Citations | 16,360 |
| Field | Electronic Packaging and Soldering Technologies |
| h-index | 61 |
| i10-index | 137 |
| Last Known Institution | City University of Hong Kong |
| OpenAlex ID | https://openalex.org/A5026517701 |
| ORCID iD | https://orcid.org/0009-0004-9230-1640 |
| Works | 204 |

## Researcher topics

- [3D IC and TSV technologies](https://scholariq.org/topics/3d-ic-and-tsv-technologies/)
- [Electronic Packaging and Soldering Technologies](https://scholariq.org/topics/electronic-packaging-and-soldering-technologies/)
- [Semiconductor materials and interfaces](https://scholariq.org/topics/semiconductor-materials-and-interfaces/)
- [Copper Interconnects and Reliability](https://scholariq.org/topics/copper-interconnects-and-reliability/)
- [Intermetallics and Advanced Alloy Properties](https://scholariq.org/topics/intermetallics-and-advanced-alloy-properties/)

## Researcher university

- [City University of Hong Kong](https://scholariq.org/institutions/city-university-of-hong-kong/)

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Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.