# Qiang Yu

**Type:** Researchers  
**Canonical URL:** https://scholariq.org/researchers/qiang-yu-3/

## Facts

| Field | Value |
| --- | --- |
| Citations | 22,619 |
| Field | Electronic Packaging and Soldering Technologies |
| h-index | 70 |
| i10-index | 424 |
| Last Known Institution | Xiamen University |
| OpenAlex ID | https://openalex.org/A5100717180 |
| ORCID iD | https://orcid.org/0009-0009-8474-8510 |
| Works | 1,317 |

## Researcher topics

- [3D IC and TSV technologies](https://scholariq.org/topics/3d-ic-and-tsv-technologies/)
- [Electronic Packaging and Soldering Technologies](https://scholariq.org/topics/electronic-packaging-and-soldering-technologies/)
- [Engineering Applied Research](https://scholariq.org/topics/engineering-applied-research/)
- [Biofuel production and bioconversion](https://scholariq.org/topics/biofuel-production-and-bioconversion/)
- [Fatigue and fracture mechanics](https://scholariq.org/topics/fatigue-and-fracture-mechanics/)

## Researcher university

- [Xiamen University](https://scholariq.org/institutions/xiamen-university/)

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Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.