# Reinhold H. Dauskardt

**Type:** Researchers  
**Canonical URL:** https://scholariq.org/researchers/reinhold-h-dauskardt/

## Facts

| Field | Value |
| --- | --- |
| Citations | 16,762 |
| Field | Copper Interconnects and Reliability |
| h-index | 63 |
| i10-index | 202 |
| Last Known Institution | Stanford University |
| OpenAlex ID | https://openalex.org/A5065203509 |
| ORCID iD | https://orcid.org/0000-0003-3989-362X |
| Works | 370 |

## Researcher topics

- [Copper Interconnects and Reliability](https://scholariq.org/topics/copper-interconnects-and-reliability/)
- [Perovskite Materials and Applications](https://scholariq.org/topics/perovskite-materials-and-applications/)
- [Conducting polymers and applications](https://scholariq.org/topics/conducting-polymers-and-applications/)
- [Advanced ceramic materials synthesis](https://scholariq.org/topics/advanced-ceramic-materials-synthesis/)
- [Electronic Packaging and Soldering Technologies](https://scholariq.org/topics/electronic-packaging-and-soldering-technologies/)

## Researcher university

- [Stanford University](https://scholariq.org/institutions/stanford-university/)

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Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.