# Copper Interconnects and Reliability

**Type:** Topics  
**Canonical URL:** https://scholariq.org/topics/copper-interconnects-and-reliability-2/

## Facts

| Field | Value |
| --- | --- |
| Citations | 343,787 |
| Description | This cluster of papers focuses on the development and characterization of low dielectric constant (low-k) materials for microelectronics, with an emphasis on their application in copper metallization and interconnect scaling. The papers cover topics such as electromigration, thin films, plasma processing, diffusion barriers, and the electrical resistivity of nanowires. |
| Domain | Physical Sciences |
| Field | Materials Science |
| OpenAlex ID | https://openalex.org/T11661 |
| Works | 39,509 |

## Topic researchers

Showing 12 of 20.

- [L. Prokhorov](https://scholariq.org/researchers/l-prokhorov/)
- [Ju Li](https://scholariq.org/researchers/ju-li/)
- [Manish Chhowalla](https://scholariq.org/researchers/manish-chhowalla/)
- [Craig J. Hawker](https://scholariq.org/researchers/craig-j-hawker/)
- [A.G. Evans](https://scholariq.org/researchers/a-g-evans/)
- [Lars Hultman](https://scholariq.org/researchers/lars-hultman/)
- [Zhigang Suo](https://scholariq.org/researchers/zhigang-suo/)
- [Hendrik J. Monkhorst](https://scholariq.org/researchers/hendrik-j-monkhorst/)
- [S. Parkin](https://scholariq.org/researchers/s-parkin/)
- [Huajian Gao](https://scholariq.org/researchers/huajian-gao/)
- [R. Stanley Williams](https://scholariq.org/researchers/r-stanley-williams/)
- [J.D. Pack](https://scholariq.org/researchers/j-d-pack/)

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Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.