# Copper Interconnects and Reliability

**Type:** Topics  
**Canonical URL:** https://scholariq.org/topics/copper-interconnects-and-reliability/

## Facts

| Field | Value |
| --- | --- |
| Description | This cluster of papers focuses on the development and characterization of low dielectric constant (low-k) materials for microelectronics, with an emphasis on their application in copper metallization and interconnect scaling. The papers cover topics such as electromigration, thin films, plasma processing, diffusion barriers, and the electrical resistivity of nanowires. |
| Domain | Physical Sciences |
| Field | Materials Science |
| OpenAlex ID | t11661 |
| Works | 11 |

## Topic papers all

- [Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds](https://scholariq.org/papers/behavior-of-aluminum-oxide-intermetallics-and-voids-in-cu-al-wire-bonds/)
- [Mechanisms and reactions during atomic layer deposition on polymers](https://scholariq.org/papers/mechanisms-and-reactions-during-atomic-layer-deposition-on-polymers/)
- [Multilayer MMIC using a 3 mu m*3-layer dielectric film structure](https://scholariq.org/papers/multilayer-mmic-using-a-3-mu-m-3-layer-dielectric-film-structure/)
- [Finite Element Analysis of Elastoplastic Indentation: Part II—Application to Hard Coatings](https://scholariq.org/papers/finite-element-analysis-of-elastoplastic-indentation-part-ii-application-to-hard/)
- [Fabrication processing of Y123 coated conductors by MOD-TFA method](https://scholariq.org/papers/fabrication-processing-of-y123-coated-conductors-by-mod-tfa-method/)
- [Experimental Issues that Impact In-Vacuum Dynamic Characterization of Thin Film Membranes](https://scholariq.org/papers/experimental-issues-that-impact-in-vacuum-dynamic-characterization-of-thin-film/)
- [Characterization of low dielectric constant plasma enhanced chemical vapor deposition fluorinated silicon oxide films as intermetal dielectric materials](https://scholariq.org/papers/characterization-of-low-dielectric-constant-plasma-enhanced-chemical-vapor/)
- [Dual-Frequency Superimposed RF Capacitive-Coupled Plasma Etch Process](https://scholariq.org/papers/dual-frequency-superimposed-rf-capacitive-coupled-plasma-etch-process/)
- [Dry etch challenges for CD shrinkage in memory process](https://scholariq.org/papers/dry-etch-challenges-for-cd-shrinkage-in-memory-process/)
- [Dry Sliding Wear of Stainless Steel Coating Obtained by Plasma on Aluminium Substrate](https://scholariq.org/papers/dry-sliding-wear-of-stainless-steel-coating-obtained-by-plasma-on-aluminium/)
- [Ascorbic Acid-Assisted Self-Assembly of 4-Aminothiophenol to Enhance Interfacial Adhesion between Copper and Ajinomoto Build-up Film](https://scholariq.org/papers/ascorbic-acid-assisted-self-assembly-of-4-aminothiophenol-to-enhance-interfacial/)

## Topic primary papers

- [Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds](https://scholariq.org/papers/behavior-of-aluminum-oxide-intermetallics-and-voids-in-cu-al-wire-bonds/)
- [Characterization of low dielectric constant plasma enhanced chemical vapor deposition fluorinated silicon oxide films as intermetal dielectric materials](https://scholariq.org/papers/characterization-of-low-dielectric-constant-plasma-enhanced-chemical-vapor/)
- [Dry etch challenges for CD shrinkage in memory process](https://scholariq.org/papers/dry-etch-challenges-for-cd-shrinkage-in-memory-process/)
- [Ascorbic Acid-Assisted Self-Assembly of 4-Aminothiophenol to Enhance Interfacial Adhesion between Copper and Ajinomoto Build-up Film](https://scholariq.org/papers/ascorbic-acid-assisted-self-assembly-of-4-aminothiophenol-to-enhance-interfacial/)

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Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.