# Electronic Packaging and Soldering Technologies

**Type:** Topics  
**Canonical URL:** https://scholariq.org/topics/electronic-packaging-and-soldering-technologies-2/

## Facts

| Field | Value |
| --- | --- |
| Citations | 600,919 |
| Description | This cluster of papers focuses on the advances and challenges in the use of lead-free solders, interfacial reactions between solders and base materials, reliability studies in electronic packaging, high-temperature electronics, nanoparticle applications, electromigration effects, thermal behavior, rare earth element additions, and the use of conductive adhesives as alternatives. |
| Domain | Physical Sciences |
| Field | Engineering |
| OpenAlex ID | https://openalex.org/T10460 |
| Works | 69,134 |

## Topic researchers

Showing 12 of 20.

- [Zhong Lin Wang](https://scholariq.org/researchers/zhong-lin-wang/)
- [F. Travasso](https://scholariq.org/researchers/f-travasso/)
- [L. Naticchioni](https://scholariq.org/researchers/l-naticchioni/)
- [A.G. Evans](https://scholariq.org/researchers/a-g-evans/)
- [Zhigang Suo](https://scholariq.org/researchers/zhigang-suo/)
- [S. Di Pace](https://scholariq.org/researchers/s-di-pace/)
- [Michael F. Ashby](https://scholariq.org/researchers/michael-f-ashby/)
- [J. L. Wright](https://scholariq.org/researchers/j-l-wright/)
- [David H. Hubel](https://scholariq.org/researchers/david-h-hubel/)
- [Zhifeng Ren](https://scholariq.org/researchers/zhifeng-ren/)
- [Yuan Liu](https://scholariq.org/researchers/yuan-liu/)
- [V. Sequino](https://scholariq.org/researchers/v-sequino/)

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Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.