# Electronic Packaging and Soldering Technologies

**Type:** Topics  
**Canonical URL:** https://scholariq.org/topics/electronic-packaging-and-soldering-technologies/

## Facts

| Field | Value |
| --- | --- |
| Description | This cluster of papers focuses on the advances and challenges in the use of lead-free solders, interfacial reactions between solders and base materials, reliability studies in electronic packaging, high-temperature electronics, nanoparticle applications, electromigration effects, thermal behavior, rare earth element additions, and the use of conductive adhesives as alternatives. |
| Domain | Physical Sciences |
| Field | Engineering |
| OpenAlex ID | t10460 |
| Works | 12 |

## Topic papers all

- [Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds](https://scholariq.org/papers/behavior-of-aluminum-oxide-intermetallics-and-voids-in-cu-al-wire-bonds/)
- [Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder](https://scholariq.org/papers/effects-of-tio2-nanoparticles-addition-on-microstructure-microhardness-and/)
- [Suppressing Crack Formation in Particulate Systems by Utilizing Capillary Forces](https://scholariq.org/papers/suppressing-crack-formation-in-particulate-systems-by-utilizing-capillary-forces/)
- [Formation and growth of interfacial intermetallics in Sn-0.3Ag-0.7Cu-xCeO2/Cu solder joints during the reflow process](https://scholariq.org/papers/formation-and-growth-of-interfacial-intermetallics-in-sn-0-3ag-0-7cu-xceo2-cu/)
- [Reliability Evaluation and Failure Analysis for NTC Thermistor](https://scholariq.org/papers/reliability-evaluation-and-failure-analysis-for-ntc-thermistor/)
- [Improving a soldering process applying the dual response approach to a Taguchi's orthogonal array](https://scholariq.org/papers/improving-a-soldering-process-applying-the-dual-response-approach-to-a-taguchi-s/)
- [Fatigue Behaviour of GFRP: Some Considerations about Interfaces](https://scholariq.org/papers/fatigue-behaviour-of-gfrp-some-considerations-about-interfaces/)
- [Flexural fatigue of GFRP : testing and modelling](https://scholariq.org/papers/flexural-fatigue-of-gfrp-testing-and-modelling/)
- [Construction of CPW Pogo Pin Probes for RFIC Measurements](https://scholariq.org/papers/construction-of-cpw-pogo-pin-probes-for-rfic-measurements/)
- [Stress factors in aircraft electronics: Superimpositions, case studies and failure precautions](https://scholariq.org/papers/stress-factors-in-aircraft-electronics-superimpositions-case-studies-and-failure/)
- [Body Mass Index, Frailty, and Outcomes in Leadless Pacemaker Implantation Body Mass Index, Frailty, and Outcomes in Leadless Pacemaker Implantation Body Mass Index, Frailty, and Outcomes in Leadless Pacemaker Implantation Body Mass Index, Frailty, and Outcomes in Leadless Pacemaker Implantation Body Mass Index, Frailty, and Outcomes in Leadless Pacemaker Implantation Body Mass Index, Frailty, and Outcomes in Leadless Pacemaker Implantation Body Mass Index, Frailty, and Outcomes in Leadless Pacemaker Implantation Body Mass Index, Frailty, and Outcomes in Leadless Pacemaker Implantation Body Mass Index, Frailty, and Outcomes in Leadless Pacemaker Implantation Body Mass Index, Frailty, and Outcomes in Leadless Pacemaker Implantation Body Mass Index, Frailty, and Outcomes in Leadless Pacemaker Implantation Body Mass Index, Frailty, and Outcomes in Leadless Pacemaker Implantation Body Mass Index, Frailty, and Outcomes in Leadless Pacemaker Implantation Body Mass Index, Frailty, and Outcomes in Leadless Pacemaker Implantation Body Mass Index, Frailty, and Outcomes in Leadless Pacemaker Implantation Body Mass Index, Frailty, and Outcomes in Leadless Pacemaker Implantation](https://scholariq.org/papers/body-mass-index-frailty-and-outcomes-in-leadless-pacemaker-implantation-body/)
- [Ascorbic Acid-Assisted Self-Assembly of 4-Aminothiophenol to Enhance Interfacial Adhesion between Copper and Ajinomoto Build-up Film](https://scholariq.org/papers/ascorbic-acid-assisted-self-assembly-of-4-aminothiophenol-to-enhance-interfacial/)

## Topic primary papers

- [Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder](https://scholariq.org/papers/effects-of-tio2-nanoparticles-addition-on-microstructure-microhardness-and/)
- [Formation and growth of interfacial intermetallics in Sn-0.3Ag-0.7Cu-xCeO2/Cu solder joints during the reflow process](https://scholariq.org/papers/formation-and-growth-of-interfacial-intermetallics-in-sn-0-3ag-0-7cu-xceo2-cu/)

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Source: ScholarIQ — public research metadata, principally OpenAlex. See https://scholariq.org/sources/ for provenance and https://scholariq.org/methodology/ for what these figures mean.