Characterization of mechanical properties and fracture mode of PLA and copper/PLA composite part manufactured by fused deposition modeling
Characterization of mechanical properties and fracture mode of PLA and copper/PLA composite part manufactured by fused deposition modeling is a paper indexed in ScholarIQ from OpenAlex.
How many citations does Characterization of mechanical properties and fracture mode of PLA and copper/PLA composite part manufactured by fused deposition modeling have?
Characterization of mechanical properties and fracture mode of PLA and copper/PLA composite part manufactured by fused deposition modeling has 73 citations in the OpenAlex counts ScholarIQ stores.
When was Characterization of mechanical properties and fracture mode of PLA and copper/PLA composite part manufactured by fused deposition modeling published?
Characterization of mechanical properties and fracture mode of PLA and copper/PLA composite part manufactured by fused deposition modeling has 2019 year in the ScholarIQ index.
What is the open-access status of Characterization of mechanical properties and fracture mode of PLA and copper/PLA composite part manufactured by fused deposition modeling?
Characterization of mechanical properties and fracture mode of PLA and copper/PLA composite part manufactured by fused deposition modeling has bronze oa status in the ScholarIQ index.
What is the DOI of Characterization of mechanical properties and fracture mode of PLA and copper/PLA composite part manufactured by fused deposition modeling?
The DOI for Characterization of mechanical properties and fracture mode of PLA and copper/PLA composite part manufactured by fused deposition modeling is on the source record.
What is the OpenAlex record for Characterization of mechanical properties and fracture mode of PLA and copper/PLA composite part manufactured by fused deposition modeling?
The OpenAlex for Characterization of mechanical properties and fracture mode of PLA and copper/PLA composite part manufactured by fused deposition modeling is on the source record.