Upload Records Snowball Search Search OpenAlex
About the database ScholarIQanswers from OpenAlex
Thermal curing behavior of phenol formaldehyde resin-impregnated paper evaluated using DSC and dielectric analysis
PaperCitations, authors & open-access status
Thermal curing behavior of phenol formaldehyde resin-impregnated paper evaluated using DSC and dielectric analysis is a paper indexed in ScholarIQ from OpenAlex. ScholarIQ records 15 citations, 2024 year and closed oa status.
15
Citations
2024
Year
closed
OA Status