Thermal curing behavior of phenol formaldehyde resin-impregnated paper evaluated using DSC and dielectric analysis
Thermal curing behavior of phenol formaldehyde resin-impregnated paper evaluated using DSC and dielectric analysis is a paper indexed in ScholarIQ from OpenAlex.
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Thermal curing behavior of phenol formaldehyde resin-impregnated paper evaluated using DSC and dielectric analysis has 15 citations in the OpenAlex counts ScholarIQ stores.
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Thermal curing behavior of phenol formaldehyde resin-impregnated paper evaluated using DSC and dielectric analysis has 2024 year in the ScholarIQ index.
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Thermal curing behavior of phenol formaldehyde resin-impregnated paper evaluated using DSC and dielectric analysis has closed oa status in the ScholarIQ index.
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