Transient simulation of coupled heat and moisture transfer through multi-layer walls exposed to future climate in the hot and humid southern China area
Transient simulation of coupled heat and moisture transfer through multi-layer walls exposed to future climate in the hot and humid southern China area is a paper indexed in ScholarIQ from OpenAlex.
How many citations does Transient simulation of coupled heat and moisture transfer through multi-layer walls exposed to future climate in the hot and humid southern China area have?
Transient simulation of coupled heat and moisture transfer through multi-layer walls exposed to future climate in the hot and humid southern China area has 44 citations in the OpenAlex counts ScholarIQ stores.
When was Transient simulation of coupled heat and moisture transfer through multi-layer walls exposed to future climate in the hot and humid southern China area published?
Transient simulation of coupled heat and moisture transfer through multi-layer walls exposed to future climate in the hot and humid southern China area has 2019 year in the ScholarIQ index.
What is the open-access status of Transient simulation of coupled heat and moisture transfer through multi-layer walls exposed to future climate in the hot and humid southern China area?
Transient simulation of coupled heat and moisture transfer through multi-layer walls exposed to future climate in the hot and humid southern China area has closed oa status in the ScholarIQ index.
What is the DOI of Transient simulation of coupled heat and moisture transfer through multi-layer walls exposed to future climate in the hot and humid southern China area?
The DOI for Transient simulation of coupled heat and moisture transfer through multi-layer walls exposed to future climate in the hot and humid southern China area is on the source record.
What is the OpenAlex record for Transient simulation of coupled heat and moisture transfer through multi-layer walls exposed to future climate in the hot and humid southern China area?
The OpenAlex for Transient simulation of coupled heat and moisture transfer through multi-layer walls exposed to future climate in the hot and humid southern China area is on the source record.