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An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue

PaperCitations, authors & open-access status

An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue is a paper indexed in ScholarIQ from OpenAlex.

How many citations does An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue have?

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An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue has 57 citations in the OpenAlex counts ScholarIQ stores.

When was An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue published?

ScholarIQyear

An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue has 2016 year in the ScholarIQ index.

What is the open-access status of An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue?

ScholarIQoa status

An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue has closed oa status in the ScholarIQ index.

What is the DOI of An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue?

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The OpenAlex for An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue is on the source record.

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