ScholarIQanswers from OpenAlex
Characterization of mechanical and thermal properties of thin Cu foils and wires
PaperCitations, authors & open-access status
Characterization of mechanical and thermal properties of thin Cu foils and wires is a paper indexed in ScholarIQ from OpenAlex.
How many citations does Characterization of mechanical and thermal properties of thin Cu foils and wires have?
ScholarIQcitation count
Characterization of mechanical and thermal properties of thin Cu foils and wires has 85 citations in the OpenAlex counts ScholarIQ stores.
When was Characterization of mechanical and thermal properties of thin Cu foils and wires published?
ScholarIQyear
Characterization of mechanical and thermal properties of thin Cu foils and wires has 2002 year in the ScholarIQ index.
What is the open-access status of Characterization of mechanical and thermal properties of thin Cu foils and wires?
ScholarIQoa status
Characterization of mechanical and thermal properties of thin Cu foils and wires has closed oa status in the ScholarIQ index.
What is the DOI of Characterization of mechanical and thermal properties of thin Cu foils and wires?
ScholarIQdoi
The DOI for Characterization of mechanical and thermal properties of thin Cu foils and wires is on the source record.
What is the OpenAlex record for Characterization of mechanical and thermal properties of thin Cu foils and wires?
ScholarIQopenalex
The OpenAlex for Characterization of mechanical and thermal properties of thin Cu foils and wires is on the source record.