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Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder

PaperCitations, authors & open-access status

Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder is a paper indexed in ScholarIQ from OpenAlex. ScholarIQ records 136 citations, 2013 year and closed oa status.

136
Citations
2013
Year
closed
OA Status

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