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Electronic Packaging and Soldering Technologies
TopicLeading institutions, researchers & key papers
This cluster of papers focuses on the advances and challenges in the use of lead-free solders, interfacial reactions between solders and base materials, reliability studies in electronic packaging, high-temperature electronics, nanoparticle applications, electromigration effects, thermal behavior, rare earth element additions, and the use of conductive adhesives as alternatives.
12
Works
IDs:OpenAlex
How has Electronic Packaging and Soldering Technologies's publication output changed over time?
ScholarIQpublication output · 2013–2018
Output grew0% over the shown period — from 1 works in 2013 to 1 in 2018.
1
1
20132018
What are the most-cited papers on Electronic Packaging and Soldering Technologies?
ScholarIQmost cited works
Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder
Yu Tang, G.Y. Li, Y.C. Pan
Materials & Design (1980-2015). 2013136 Citations
Formation and growth of interfacial intermetallics in Sn-0.3Ag-0.7Cu-xCeO2/Cu solder joints during the reflow process
Yu Tang, Qinhan Guo, Shuqiong Luo, Z.H. Li, G.Y. Li, Chaojun Hou, Zichun Zhong, Jiajun Zhuang
S67716761. 201843 Citations
Where is Electronic Packaging and Soldering Technologies research published, and who funds it?
ScholarIQvenues & funding sources
TOP JOURNALS
S6771676143
TOP FUNDERS
National Science Foundation—
NIH—
Wellcome Trust—
European Research Council—
Funder breakdown is a member featureSign up free to unlock
How much of the research on Electronic Packaging and Soldering Technologies is open access?
ScholarIQopen access share
0%OPEN ACCESS
Gold
0%
Green
0%
Hybrid
0%
Bronze
0%
Closed
100%
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Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder
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Suppressing Crack Formation in Particulate Systems by Utilizing Capillary Forces
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Formation and growth of interfacial intermetallics in Sn-0.3Ag-0.7Cu-xCeO2/Cu solder joints during the reflow process
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Reliability Evaluation and Failure Analysis for NTC Thermistor
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