ScholarIQanswers from OpenAlex
Electronic Packaging and Soldering Technologies
TopicLeading institutions, researchers & key papers
Electronic Packaging and Soldering Technologies is a topic indexed in ScholarIQ from OpenAlex.
What is known about Electronic Packaging and Soldering Technologies?
ScholarIQrecord summary
This cluster of papers focuses on the advances and challenges in the use of lead-free solders, interfacial reactions between solders and base materials, reliability studies in electronic packaging, high-temperature electronics, nanoparticle applications, electromigration effects, thermal behavior, rare earth element additions, and the use of conductive adhesives as alternatives.
How many works does Electronic Packaging and Soldering Technologies have?
ScholarIQindexed works
Electronic Packaging and Soldering Technologies has 12 works in the ScholarIQ index. The count is the OpenAlex total, not the number of papers listed on this page.
What is the OpenAlex record for Electronic Packaging and Soldering Technologies?
ScholarIQopenalex
The OpenAlex for Electronic Packaging and Soldering Technologies is on the source record.
What are the most-cited papers on Electronic Packaging and Soldering Technologies?
ScholarIQmost cited works
Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder
Yu Tang, G.Y. Li, Y.C. Pan
Formation and growth of interfacial intermetallics in Sn-0.3Ag-0.7Cu-xCeO2/Cu solder joints during the reflow process
Yu Tang, Qinhan Guo, Shuqiong Luo, Z.H. Li, G.Y. Li, Chaojun Hou, Zichun Zhong, Jiajun Zhuang
Where is Electronic Packaging and Soldering Technologies research published, and who funds it?
ScholarIQvenues & funding sources
TOP JOURNALS
TOP FUNDERS
National Science Foundation—
NIH—
Wellcome Trust—
European Research Council—
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How much of the research on Electronic Packaging and Soldering Technologies is open access?
ScholarIQopen access share
0%OPEN ACCESS