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Fabrication of Capacitive Micromachined Ultrasonic Transducer Arrays With Isolation Trenches Using Anodic Wafer Bonding

PaperCitations, authors & open-access status

Fabrication of Capacitive Micromachined Ultrasonic Transducer Arrays With Isolation Trenches Using Anodic Wafer Bonding is a paper indexed in ScholarIQ from OpenAlex. ScholarIQ records 28 citations, 2015 year and closed oa status.

28
Citations
2015
Year
closed
OA Status

Related on ScholarIQ

J. Jayapandian
Author
IEEE Sensors Journal
Journal
Advanced MEMS and NEMS Technologies
Topic
Advanced MEMS and NEMS Technologies
Topic
Advanced Sensor and Energy Harvesting Materials
Topic
Ultrasonics and Acoustic Wave Propagation
Topic
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