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Formation and growth of interfacial intermetallics in Sn-0.3Ag-0.7Cu-xCeO2/Cu solder joints during the reflow process
PaperCitations, authors & open-access status
Formation and growth of interfacial intermetallics in Sn-0.3Ag-0.7Cu-xCeO2/Cu solder joints during the reflow process is a paper indexed in ScholarIQ from OpenAlex. ScholarIQ records 43 citations, 2018 year and closed oa status.
43
Citations
2018
Year
closed
OA Status