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Influence of Colloidal Abrasive Size on Material Removal Rate and Surface Finish in SiO<sub>2</sub>Chemical Mechanical Polishing

PaperCitations, authors & open-access status

Influence of Colloidal Abrasive Size on Material Removal Rate and Surface Finish in SiO<sub>2</sub>Chemical Mechanical Polishing is a paper indexed in ScholarIQ from OpenAlex. ScholarIQ records 93 citations, 2002 year and closed oa status.

93
Citations
2002
Year
closed
OA Status

Related on ScholarIQ

S. Danyluk
Author
Tribology Transactions
Journal
Advanced Surface Polishing Techniques
Topic
Advanced Surface Polishing Techniques
Topic
Advanced machining processes and optimization
Topic
Adhesion, Friction, and Surface Interactions
Topic
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