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Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds

PaperCitations, authors & open-access status

Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds is a paper indexed in ScholarIQ from OpenAlex. ScholarIQ records 247 citations, 2011 year and closed oa status.

247
Citations
2011
Year
closed
OA Status

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