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Copper Interconnects and Reliability
TopicLeading institutions, researchers & key papers
This cluster of papers focuses on the development and characterization of low dielectric constant (low-k) materials for microelectronics, with an emphasis on their application in copper metallization and interconnect scaling. The papers cover topics such as electromigration, thin films, plasma processing, diffusion barriers, and the electrical resistivity of nanowires.
11
Works
IDs:OpenAlex
How has Copper Interconnects and Reliability's publication output changed over time?
ScholarIQpublication output · 1998–2026
Output grew0% over the shown period — from 1 works in 1998 to 1 in 2026.
1
1
1
1
1998201120152026
What are the most-cited papers on Copper Interconnects and Reliability?
ScholarIQmost cited works
Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds
Huining Xu, C. Liu, Vadim V. Silberschmidt, Stevin S. Pramana, Timothy J. White, Zhong Chen, Viola L. Acoff
S64016596. 2011247 Citations
Characterization of low dielectric constant plasma enhanced chemical vapor deposition fluorinated silicon oxide films as intermetal dielectric materials
Kwangtaek Kim, Dae‐Hyuk Kwon, G. Nallapati, G. S. Lee
S4210190837. 199825 Citations
Dry etch challenges for CD shrinkage in memory process
T. Matsushita, Takanori Matsumoto, Hidefumi Mukai, Suigen Kyoh, Kohji Hashimoto
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 20156 Citations
Ascorbic Acid-Assisted Self-Assembly of 4-Aminothiophenol to Enhance Interfacial Adhesion between Copper and Ajinomoto Build-up Film
Xindi Xu, Chi Zhang, Wei-Yi Zhang, Yang Chao, MA Xian-yin, Yuanrong Cheng, Tianwen Jiang, Wen-Bin Cai
S75741262. 20260 Citations
Where is Copper Interconnects and Reliability research published, and who funds it?
ScholarIQvenues & funding sources
TOP JOURNALS
S64016596247
S421019083725
S757412620
TOP FUNDERS
National Science Foundation—
NIH—
Wellcome Trust—
European Research Council—
Funder breakdown is a member featureSign up free to unlock
How much of the research on Copper Interconnects and Reliability is open access?
ScholarIQopen access share
0%OPEN ACCESS
Gold
0%
Green
0%
Hybrid
0%
Bronze
0%
Closed
100%
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