ScholarIQanswers from OpenAlex
Copper Interconnects and Reliability
TopicLeading institutions, researchers & key papers
Copper Interconnects and Reliability is a topic indexed in ScholarIQ from OpenAlex.
What is known about Copper Interconnects and Reliability?
ScholarIQrecord summary
This cluster of papers focuses on the development and characterization of low dielectric constant (low-k) materials for microelectronics, with an emphasis on their application in copper metallization and interconnect scaling. The papers cover topics such as electromigration, thin films, plasma processing, diffusion barriers, and the electrical resistivity of nanowires.
How many works does Copper Interconnects and Reliability have?
ScholarIQindexed works
Copper Interconnects and Reliability has 11 works in the ScholarIQ index. The count is the OpenAlex total, not the number of papers listed on this page.
What is the OpenAlex record for Copper Interconnects and Reliability?
ScholarIQopenalex
The OpenAlex for Copper Interconnects and Reliability is on the source record.
What are the most-cited papers on Copper Interconnects and Reliability?
ScholarIQmost cited works
Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds
Huining Xu, C. Liu, Vadim V. Silberschmidt, Stevin S. Pramana, Timothy J. White, Zhong Chen, Viola L. Acoff
Characterization of low dielectric constant plasma enhanced chemical vapor deposition fluorinated silicon oxide films as intermetal dielectric materials
Kwangtaek Kim, Dae‐Hyuk Kwon, G. Nallapati, G. S. Lee
Dry etch challenges for CD shrinkage in memory process
T. Matsushita, Takanori Matsumoto, Hidefumi Mukai, Suigen Kyoh, Kohji Hashimoto
Ascorbic Acid-Assisted Self-Assembly of 4-Aminothiophenol to Enhance Interfacial Adhesion between Copper and Ajinomoto Build-up Film
Xindi Xu, Chi Zhang, Wei-Yi Zhang, Yang Chao, MA Xian-yin, Yuanrong Cheng, Tianwen Jiang, Wen-Bin Cai
Where is Copper Interconnects and Reliability research published, and who funds it?
ScholarIQvenues & funding sources
TOP JOURNALS
TOP FUNDERS
National Science Foundation—
NIH—
Wellcome Trust—
European Research Council—
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How much of the research on Copper Interconnects and Reliability is open access?
ScholarIQopen access share
0%OPEN ACCESS